We’re looking to improve our heatsinking for the GigaBlox Rugged. We’d like to input this into our thermal simulation. What components dissipate the most power on this board?
A
Typical power dissipation: 2.315 Watts
Maximum power dissipation (at 110C°): 3.16 Watts
B
Typical power dissipation~ 0.5 Watts
C
Typical power dissipation~ 0.5 Watts
Would you happen to have the mass of copper and FR4 used in the PCB? I’m aiming to run a more accurate thermal simulation and would prefer not to oversimplify the entire board as a low-conductivity FR4 volume.
Specifically, I’m looking for:
- Total mass of copper used in the PCB
- Total mass of FR4 used in the PCB
This request pertains only to the PCB substrate itself and does not include any mounted components.
Board is six layers. Copper area per layer is below.
Copper thickness on all layers = 1oz (0.035mm)
Top layer area = 964mm2
= 33.74mm3
Inner layer 1 area = 2405mm2
= 84.175mm3
Inner layer 2 area = 1361mm2
= 47.635mm3
Inner layer 3 area = 2365mm2
= 82.775mm3
Inner layer 4 area = 2257mm2
= 78.995mm3
Bottom layer area = 898mm2
= 31.43mm3
FR4 area = 3025mm2
FR4 thickness ~ 2mm
~ 6050mm3